跳至主導覽
跳至搜尋
跳過主要內容
國立中央大學 首頁
說明與常見問題
連結會在新分頁中開啟
English
中文
在 國立中央大學 搜尋內容
首頁
人才檔案
研究單位
研究計畫
研究成果
資料集
榮譽/獲獎
學術活動
新聞/媒體
影響
Development of New Low Melting Solder Alloys
Chih Hao Chen
, Boon Ho Lee
, Hsiang Chuan Chen
, Chang Meng Wang
,
Albert T. Wu
化學工程與材料工程學系
研究成果
:
書貢獻/報告類型
›
會議論文篇章
›
同行評審
3
引文 斯高帕斯（Scopus）
總覽
指紋
指紋
深入研究「Development of New Low Melting Solder Alloys」主題。共同形成了獨特的指紋。
排序方式
重量
按字母排序
Keyphrases
3D IC
25%
Activation Energy
25%
Advanced 3D
25%
Advanced Packaging Technology
25%
Amorphous InGaZnO (a-IGZO)
25%
Basin Type
50%
Bi-based Solder
25%
Bonding Process
25%
Coefficient of Thermal Expansion
25%
Common Elements
25%
Cross-sectional Microstructure
25%
Cu Substrate
50%
Cu6Sn5
25%
Electron Probe Microanalyzer
25%
Fast Dissolution
25%
Gallium
25%
High Temperature
25%
IC Assembly
25%
IC chip
25%
Interfacial Intermetallic Compound
25%
Intermetallic Compound Formation
25%
Intermetallic Compounds
50%
Joint Strength
25%
Layer Stacking
25%
Low Melting
100%
Low Temperature
25%
Low-melting-point Alloy
50%
Melting Temperature
100%
Microstructure
50%
Microstructure Investigation
25%
Molten Solder
25%
Multiple Layers
25%
Pb-free
25%
Pb-free Solder
25%
Peak Temperature
25%
Reflowing
25%
Scanning Electron Microscope Image
25%
Shear Test
25%
Sn-Bi
25%
Solder Alloys
100%
Soldering
25%
Thermal Aging Test
25%
Thermal Process
25%
Thin Wafer
25%
Transient Liquid Phase Bonding
25%
Wafer
25%
Warpage
50%
Engineering
Activation Energy
16%
Alloy Melting
16%
Alloying
16%
Coefficient of Thermal Expansion
16%
Common Element
16%
Electron Probe Micro Analyzer
16%
Eutectics
66%
Free Solder
16%
Intermetallics
50%
Joint Strength
16%
Key Process
16%
Liquid Phase
16%
Low-Temperature
33%
Melting Point
100%
Melting Temperature
66%
Mols
16%
Peak Temperature
16%
Thermal Process
16%
Transients
16%
Material Science
Activation Energy
33%
Alloying
33%
Electron Probe Microanalyzer
33%
Gallium
33%
Intermetallics
100%
Lead-Free Solder
33%
Scanning Electron Microscopy
33%
Shear Testing
33%
Thermal Aging
33%
Thermal Expansion
33%