Development of hot melt adhesive pad and its application to polishing of monocrystalline silicon

S. L. Tsai, H. Z. Ke, J. H. Ke, F. Y. Huang, B. H. Yan

研究成果: 雜誌貢獻期刊論文同行評審

3 引文 斯高帕斯(Scopus)

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Engineering & Materials Science