Development of hot melt adhesive pad and its application to polishing of monocrystalline silicon

S. L. Tsai, H. Z. Ke, J. H. Ke, F. Y. Huang, B. H. Yan

研究成果: 雜誌貢獻期刊論文同行評審

3 引文 斯高帕斯(Scopus)

摘要

This study has developed a new polishing pad and an accompanying group of parameters for polishing monocrystalline silicon. A hot melt adhesive polishing pad coated with SiC abrasive uses these parameters more effectively and provides better polishing quality when compared with a conventional wool pad. Three control parameters, feed rate, polishing load and turning speed of the polishing wheel, were tested to identify their impact on the polishing quality of the silicon surface. A silicon surface polished with the proposed new pad under optimum conditions can obtain surface roughness of 2.45 nm Ra with mirror-like appearance.

原文???core.languages.en_GB???
頁(從 - 到)92-102
頁數11
期刊Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture
226
發行號1
DOIs
出版狀態已出版 - 1月 2012

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