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Design, fabrication, and reliability testing of embedded optical interconnects on package
Shashikant Hegde
, Raghuram V. Pucha
, Daniel Guidotti
, Fuhan Liu
,
Yin Jung Chang
, Rao Tummala
, Gee Kung Chang
, Suresh K. Sitaraman
光電科學與工程學系
研究成果
:
雜誌貢獻
›
會議論文
›
同行評審
9
引文 斯高帕斯(Scopus)
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深入研究「Design, fabrication, and reliability testing of embedded optical interconnects on package」主題。共同形成了獨特的指紋。
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Keyphrases
Optical Interconnects
100%
Reliability Testing
100%
Design Testing
100%
Fabrication Testing
100%
Waveguide
66%
Refractive Index
33%
Thermal Stability
33%
Cost Reduction
33%
Process Integration
33%
Detector Array
33%
Passive Elements
33%
Decreasing Losses
33%
Active Devices
33%
Polymer Materials
33%
Technology Integration
33%
Optical Interface
33%
Number of Factors
33%
Extended Bandwidth
33%
Testbed Design
33%
Interconnection System
33%
Amplifier Array
33%
Material Process
33%
Optical Losses
33%
Spectral Absorption
33%
Polymer Integration
33%
Optoelectronic Materials
33%
Optical Aging
33%
Optical Lasers
33%
Package Level
33%
Optical Interconnections
33%
Short-haul
33%
Backplane
33%
Electrical Interconnection
33%
Interconnect Design
33%
Optical Amplifiers
33%
Chip-to-Chip Interconnection
33%
Laser Array
33%
Optoelectronic Technique
33%
Index Stability
33%
Engineering
Optical Interconnect
100%
Waveguide
66%
Optoelectronics
66%
Refractive Index
33%
Passive Element
33%
Active Device
33%
Technology Integration
33%
Optical Interface
33%
Polymer Material
33%
Detector Array
33%
Optical Loss
33%
Optical Interconnection
33%
Optical Amplifier
33%
Refractivity
33%
Material Science
Waveguide
100%
Thermal Stability
50%
Refractive Index
50%
Optical Interconnection
50%
Optical Loss
50%
Absorption Spectra
50%
Amplifier
50%