Design, fabrication, and reliability testing of embedded optical interconnects on package

Shashikant Hegde, Raghuram V. Pucha, Daniel Guidotti, Fuhan Liu, Yin Jung Chang, Rao Tummala, Gee Kung Chang, Suresh K. Sitaraman

研究成果: 雜誌貢獻會議論文同行評審

9 引文 斯高帕斯(Scopus)


Optical interconnections offer a potential solution to some of the bottlenecks that electrical interconnection systems face. Some of the challenges with optical interconnect design and development are the introduction of new optoelectronic materials and processes, the increasing bandwidth and decreasing loss requirements, and the need for reducing cost without compromising reliability. The goal of this paper is to report our ongoing work on optical interconnects and interfaces for very short-haul backplane, and board/package-level chip-to-chip interconnections. This research will fit in with our future proposed integration technology of embedded optoelectronic active devices such as detector arrays, optical amplifiers and laser arrays coupled to the waveguide by alignment tolerant beam turning passive elements. Through testbed design, fabrication, and reliability testing, the waveguide polymer materials and integration process will be evaluated based on a number of factors which include: optical loss, roughness, optical aging, spectral absorption, refractive index and thermal stability.

頁(從 - 到)895-900
期刊Proceedings - Electronic Components and Technology Conference
出版狀態已出版 - 2004
事件2004 Proceedings - 54th Electronic Components and Technology Conference - Las Vegas, NV, United States
持續時間: 1 6月 20044 6月 2004


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