Design and fabrication of passive components using TF-IPD technology

Keyphrases

• Passive Component 100%
• RF Performance 100%
• Process Technology 100%
• IPD Technology 100%
• High Performance 50%
• Inductors 50%
• Filter Design 50%
• Electroplating 50%
• Low-pass Filter 50%
• Resistors 50%
• Integrated Passive Device 50%
• Manufacturing Technology 50%
• Thinning Process 50%
• Capacitors 50%
• In-package 50%
• Thin Film Fabrication 50%
• Glass Wafer 50%
• Thick Cu 50%
• Performance Process 50%
• RF System 50%
• Low-cost Manufacturing 50%
• 2.4 GHz ISM Band 50%
• Small Form Factor 50%
• Metal-backed 50%
• Trace Metals 50%
• Cu Metal 50%
• ISM Band Applications 50%
• Substrate Thinning 50%

Engineering

• Thin Films 100%
• Filter Design 100%
• Lowpass Filter 100%
• Passive Device 100%
• Passive Component 100%
• Manufacturing Engineering 100%
• Thinning Process 100%
• Back Side 100%
• System-in-Package 100%