@inproceedings{92c5e502d15c414e904265ff99eb2cb9,
title = "Design and fabrication of passive components using TF-IPD technology",
abstract = "In this paper, we develop a low-cost manufacturing technology for RF system-in-package applications. This high-performance process technology for integrated passive devices is achieved by electroplated formed thick Cu metal trace and back-side substrate thinning process on 8-inch glass wafer. This paper first presents investigations for common integration of inductors, resistors, capacitors in this thin film process technology and examines their RF performance. Then, a lowpass filter design for 2.4 GHz ISM band application is also demonstrated. Good RF performance as well as small form factor are achieved.",
keywords = "EM simulation, Filter, Glass substrate, Thin-film integrated passive device (TF-IPD)",
author = "Tsaitzu Lee and Lin, {Yo Shen} and Chiajiun Chen",
year = "2009",
doi = "10.1109/IMPACT.2009.5382289",
language = "???core.languages.en_GB???",
isbn = "9781424443413",
series = "IMPACT Conference 2009 International 3D IC Conference - Proceedings",
pages = "722--725",
booktitle = "IMPACT Conference 2009 International 3D IC Conference - Proceedings",
note = "IMPACT Conference 2009 International 3D IC Conference ; Conference date: 21-10-2009 Through 23-10-2009",
}