Defect Detection on Wafer Map Using Efficient Convolutional Neural Network

Chieng Yang Wang, Tsung Han Tsai

研究成果: 書貢獻/報告類型會議論文篇章同行評審

摘要

In semiconductor manufacturing, defect patterns on wafer maps hide important information about production problems. Therefore, the detection and identification of wafer pattern defects are one of the important topics in semiconductor manufacturing. Since there are few datasets of wafer maps, this paper solves the problem of overfitting by classifying wafer map defects using the model base on MobileNet V2. Finally, the accuracy of the WM-811K dataset reaches 96.56%.

原文???core.languages.en_GB???
主出版物標題2021 IEEE International Conference on Consumer Electronics-Taiwan, ICCE-TW 2021
發行者Institute of Electrical and Electronics Engineers Inc.
ISBN(電子)9781665433280
DOIs
出版狀態已出版 - 2021
事件8th IEEE International Conference on Consumer Electronics-Taiwan, ICCE-TW 2021 - Penghu, Taiwan
持續時間: 15 9月 202117 9月 2021

出版系列

名字2021 IEEE International Conference on Consumer Electronics-Taiwan, ICCE-TW 2021

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???event.eventtypes.event.conference???8th IEEE International Conference on Consumer Electronics-Taiwan, ICCE-TW 2021
國家/地區Taiwan
城市Penghu
期間15/09/2117/09/21

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