Customized PEEK implants with microporous and surface modification using 3D printing

Chao Yaug Liao, Po Lun Wu, Chao Yu Lee

研究成果: 書貢獻/報告類型會議論文篇章同行評審

3 引文 斯高帕斯(Scopus)

摘要

Polyetheretherketone (PEEK) is a high-performance, semi-crystalline thermal polymer with medical advantages such as biocompatibility and radiolucency. PEEK has an elastic modulus comparable to that of human cortical bone, so it can effectively reduce the stress shielding effect caused by the mismatch between the mechanical properties of an implant and human bone tissue. However, PEEK is biologically inert, and its use typically relies on a variety of surface modification methods, such as surface coatings of bio-ceramic materials, enhancing the surface bioactivity, and osseointegration. Compared to thermal spray or plasma spray technologies, the cold spray is carried out at relatively low temperatures, retaining the original properties of the material. This research establishes an open-source three-dimensional printer compatible with PEEK and also develops a powder-spray module based on the cold spray technology that can coat the surfaces of PEEK printings with hydroxyapatite (HA) to improve its bioactivity. This paper discusses the best parameter selection for PEEK printing, a thermal history analysis of the printing process, and the adhesion of HA powder coated on PEEK specimens with different porosities. Finally, the PEEK implant is printed to measure its performance under a vertical load.

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主出版物標題24th Design for Manufacturing and the Life Cycle Conference; 13th International Conference on Micro- and Nanosystems
發行者American Society of Mechanical Engineers (ASME)
ISBN(電子)9780791859223
DOIs
出版狀態已出版 - 2019
事件ASME 2019 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC-CIE 2019 - Anaheim, United States
持續時間: 18 8月 201921 8月 2019

出版系列

名字Proceedings of the ASME Design Engineering Technical Conference
4

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???event.eventtypes.event.conference???ASME 2019 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC-CIE 2019
國家/地區United States
城市Anaheim
期間18/08/1921/08/19

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