Cu Nanoparticle Sintering by Electrical Current

In this research, copper nanoparticles are packed into a V-shaped groove etched on a silicon substrate to explore how electric current affects their sintering process. This sintering is effectively carried out at a room temperature of 25°C. U sing an electrical current in the sintering process significantly reduces void formation in the copper, which is a notable improvement over non-electrically assisted methods. Conducting the process at ambient temperature is beneficial as it minimizes the effects of Joule heating. Critical aspects of this process involve the stimulation of atomic movement by the electric current and the migration of atoms over the surfaces of the particles. There is a particular focus on the current crowding phenomenon that occurs in the narrow regions between particles. The study aims to elucidate the importance of how electric current impacts the compaction and electrical properties of copper nanoparticles.