Cross-interaction effect in the Ni/Sn/Cu solder joints

H. W. Tseng, S. J. Wang, C. Y. Liu

研究成果: 書貢獻/報告類型會議論文篇章同行評審

1 引文 斯高帕斯(Scopus)

摘要

The mutual interaction between Sn/Ni and Sn/Cu interfacial reactions in a Ni/Sn/Cu sandwich solder joint structure has been discussed in this present work. The major interfacial reaction product on the Sn/Cu interface was Cu 6Sn5 phase, while on the Sn/Ni interface, a ternary (Cu,Ni)6Sn5 compound layer was formed, instead of the typical Ni-Sn compound phase. On the other hand, an asymmetrical solder microstructure was observed in the Ni/Sn/Cu solder joint. The asymmetrical solder microstructure resulted from the Cu concentration gradient along the Ni/Sn/Cu solder joint. Mechanical tensile tests showed that the mechanical property of the Ni/Sn/Cu solder joint is highly correlated with the asymmetrical solder microstructure.

原文???core.languages.en_GB???
主出版物標題EPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference
頁面325-330
頁數6
DOIs
出版狀態已出版 - 2009
事件2009 11th Electronic Packaging Technology Conference, EPTC 2009 - Singapore, Singapore
持續時間: 9 12月 200911 12月 2009

出版系列

名字Proceedings of the Electronic Packaging Technology Conference, EPTC

???event.eventtypes.event.conference???

???event.eventtypes.event.conference???2009 11th Electronic Packaging Technology Conference, EPTC 2009
國家/地區Singapore
城市Singapore
期間9/12/0911/12/09

指紋

深入研究「Cross-interaction effect in the Ni/Sn/Cu solder joints」主題。共同形成了獨特的指紋。

引用此