@inproceedings{1395c32fdd7f4c93a6fe92b96ea091ee,
title = "Creep rupture of a lead-free sn-ag-cu solder",
author = "Lin, {C. K.} and Chu, {D. Y.}",
year = "2006",
doi = "10.1007/1-4020-4972-2_232",
language = "???core.languages.en_GB???",
series = "Fracture of Nano and Engineering Materials and Structures - Proceedings of the 16th European Conference of Fracture",
publisher = "Kluwer Academic Publishers",
pages = "469--470",
editor = "E.E. Gdoutos",
booktitle = "Fracture of Nano and Engineering Materials and Structures - Proceedings of the 16th European Conference of Fracture",
note = "16th European Conference of Fracture ; Conference date: 03-07-2006 Through 07-07-2006",
}