Coupling effect in Pt/Sn/Cu sandwich solder joint structures

S. J. Wang, C. Y. Liu

研究成果: 雜誌貢獻期刊論文同行評審

25 引文 斯高帕斯(Scopus)

摘要

The interaction between Sn/Cu and Sn/Pt interfacial reactions in Pt/Sn/Cu sandwich joint structures was studied. We found the interfacial Sn/Pt reaction to be greatly influenced by the opposite Sn/Cu reaction. The PtSn4 interfacial compound formation rate was very sluggish compared with that of the single Sn/Pt reaction case. On the other hand, the growth rate of the Cu6Sn5 compound at the Sn/Cu interface was not affected by the opposite Sn/Pt reaction, which has a rate similar to that of the single Sn/Cu reaction case. However, the morphology of the Cu6Sn5 grains was different than in the single Sn/Cu reaction case (i.e. it had the conventional scallop-type shape). In the sandwich case, the Cu6Sn5 grains had a column-like appearance. The column-like morphology of the Cu6Sn5 grains is due to the small interfacial energy, γsolder / Cu6 Sn5, caused by the dissolution of Pt from the molten solder. Also, we found that the Pt dissolution would also cause a reduction in the solubility of Cu in the molten solder. The above two parameter changes lead to a diminishing of the ripening flux among Cu6Sn5 grains. Hence, smaller Cu6Sn5 grains would not be depleted and the separation distance between Cu6Sn5 grains would not be widened.

原文???core.languages.en_GB???
頁(從 - 到)3327-3335
頁數9
期刊Acta Materialia
55
發行號10
DOIs
出版狀態已出版 - 6月 2007

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