Correlation between interfacial reactions and mechanical strengths of Sn(Cu)/Ni(P) solder bumps

S. J. Wang, H. J. Kao, C. Y. Liu

研究成果: 雜誌貢獻期刊論文同行評審

27 引文 斯高帕斯(Scopus)

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Engineering & Materials Science

Chemical Compounds

Physics & Astronomy