Copper conductive lines on flexible substrates fabricated at room temperature

Keyphrases

• 3,4-dihydroxyphenylalanine 20%
• Adhesion 40%
• Ascorbic Acid 100%
• Conductive Lines 100%
• Conductive Pattern 20%
• Cu Atoms 20%
• Cu Particles 20%
• Cu Pattern 40%
• Electrical Conductivity 20%
• Flexible Electronic Devices 20%
• Flexible Substrate 100%
• Low Resistivity 20%
• Mechanical Strength 20%
• Optimal Concentration 20%
• Paper Electronics 20%
• Polyethylene Terephthalate 20%
• Polymer Substrate 40%
• Printing Paper 20%
• Printing Technology 20%
• Pure Cu 20%
• Room Temperature 100%
• Spray Printing 20%
• XPS Characterization 20%
• XRD Characterization 20%

Engineering

• Conductive 100%
• Electrical Conductivity 25%
• Flexible Electronics 25%
• Flexible Substrate 100%
• Room Temperature 100%
• Sintering 75%

Material Science

• Electrical Conductivity 33%
• Electrical Resistivity 33%
• Polyethylene Terephthalate 33%
• Sintering 100%
• X-Ray Diffraction 33%