Contamination reduction for 150 mm SiC substrates by integrating CMP and Post-CMP cleaning

Chi Hsiang Hsieh, Ming Hsun Lee, Chao Chang A. Chen, Chang Ching Tu, Hao Chung Kuo

研究成果: 雜誌貢獻 › 期刊論文 › 同行評審

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Keyphrases

Material Science

Engineering