Considerations of characterizing standard SMT packages for RFIC applications

J. D.S. Deng; H. K. Chiou

Considerations of characterizing standard SMT packages for RFIC applications

J. D.S. Deng, H. K. Chiou

電機工程學系

研究成果: 會議貢獻類型 › 會議論文 › 同行評審

1 引文斯高帕斯（Scopus）

摘要

Discussions for modeling RF characterization of commercial SMT package are made in this paper. This modeling approach applied L-matrix, C-matrix and ground inductance extraction techniques of package leads for initial electrical parameters of a package. Then a direct leads measurement was performed to model the package for wireless communication applications. Relationship between package ground inductance and number of grounded leads is presented. Package back to back measurement was made to verify package parameters.

原文	???core.languages.en_GB???
頁面	97-100
頁數	4
出版狀態	已出版 - 1998
事件	Proceedings of the 1998 IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging - West Point, NY, USA 持續時間: 26 10月 1998 → 28 10月 1998

???event.eventtypes.event.conference???

???event.eventtypes.event.conference???	Proceedings of the 1998 IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging
城市	West Point, NY, USA
期間	26/10/98 → 28/10/98

引用此

@conference{5460407709f643ef917204934e8bdd4d,

title = "Considerations of characterizing standard SMT packages for RFIC applications",

abstract = "Discussions for modeling RF characterization of commercial SMT package are made in this paper. This modeling approach applied L-matrix, C-matrix and ground inductance extraction techniques of package leads for initial electrical parameters of a package. Then a direct leads measurement was performed to model the package for wireless communication applications. Relationship between package ground inductance and number of grounded leads is presented. Package back to back measurement was made to verify package parameters.",

author = "Deng, {J. D.S.} and Chiou, {H. K.}",

year = "1998",

language = "???core.languages.en_GB???",

pages = "97--100",

note = "Proceedings of the 1998 IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging ; Conference date: 26-10-1998 Through 28-10-1998",

}

TY - CONF

T1 - Considerations of characterizing standard SMT packages for RFIC applications

AU - Deng, J. D.S.

AU - Chiou, H. K.

PY - 1998

Y1 - 1998

N2 - Discussions for modeling RF characterization of commercial SMT package are made in this paper. This modeling approach applied L-matrix, C-matrix and ground inductance extraction techniques of package leads for initial electrical parameters of a package. Then a direct leads measurement was performed to model the package for wireless communication applications. Relationship between package ground inductance and number of grounded leads is presented. Package back to back measurement was made to verify package parameters.

AB - Discussions for modeling RF characterization of commercial SMT package are made in this paper. This modeling approach applied L-matrix, C-matrix and ground inductance extraction techniques of package leads for initial electrical parameters of a package. Then a direct leads measurement was performed to model the package for wireless communication applications. Relationship between package ground inductance and number of grounded leads is presented. Package back to back measurement was made to verify package parameters.

UR - http://www.scopus.com/inward/record.url?scp=0032303241&partnerID=8YFLogxK

M3 - 會議論文

AN - SCOPUS:0032303241

SP - 97

EP - 100

T2 - Proceedings of the 1998 IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging

Y2 - 26 October 1998 through 28 October 1998

ER -

Considerations of characterizing standard SMT packages for RFIC applications

摘要

???event.eventtypes.event.conference???

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