Co-sputtered Cu(Ti) thin alloy film for formation of Cu diffusion and chip-level bonding

Po Chen Lin, Hao Chen, Hsien Chien Hsieh, Tsan Hsien Tseng, Hsin Yi Lee, Albert T. Wu

研究成果: 雜誌貢獻期刊論文同行評審

10 引文 斯高帕斯(Scopus)

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Keyphrases

Engineering

Material Science

Chemical Engineering