CMOS-Compatible Silicon Etched U-Grooves With Groove-First Fabrication for Nanophotonic Applications

Pei Hsun Wang, Hung Chun Liu, Hung Yu Chen, Yi Xian Zhong, Kuan Heng Chen

研究成果: 雜誌貢獻期刊論文同行評審

3 引文 斯高帕斯(Scopus)

摘要

We propose a method for process integration to passively edge-couple the optical fibers with on-chip integrated waveguides. By fabricating U-grooves before the waveguide formation, the groove-first process provides a universal platform for hybrid, large-scale fiber-to-waveguide interconnection. This integrated method simplifies the groove formation and avoids unwanted waveguide damage during the conventional groove formation. Besides, the groove-first process can be utilized with the pre-defined layers for cost reduction. The demonstrated groove-first fabrication helps to improve the coupling stability and suppress the power variation. Time-dependent measurements exhibit > 3.5 dB improvement in the power stability. We also show that this groove structure can provide stable coupling with a high-power input up to 300 mW. In addition, a naturally process-induced inverse-taper with sub-micrometer resolution is formed under conventional UV contact lithography, which potentially provides efficient conversion between the fiber-to-waveguide mode. The groove-first method builds a universal, simple, and flexible integration process for silicon photonics.

原文???core.languages.en_GB???
頁(從 - 到)1230-1233
頁數4
期刊IEEE Photonics Technology Letters
34
發行號22
DOIs
出版狀態已出版 - 15 11月 2022

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