Chip-to-chip optoelectronics SOP on organic boards or packages

Keyphrases

• ChIP-chip 100%
• Package-on-package 100%
• Optoelectronic System 100%
• Passive Component 66%
• High Performance 33%
• High Density 33%
• Microlens 33%
• Active Devices 33%
• Printed Circuit Board 33%
• Highly Integrated 33%
• Polymer Surface 33%
• Optical Components 33%
• Large-scale Integration 33%
• Optical Functions 33%
• Manufacturing Methods 33%
• Low-cost Manufacturing 33%
• P-i-n Photodetector 33%
• Surface Relief Gratings 33%
• FR-4 33%
• Mixed-signal System 33%
• Essential Buildings 33%
• Bare Die 33%
• Passive Devices 33%
• Local Smoothness 33%
• Radio-electronic Devices 33%
• Polymer Buffer Layer 33%
• Multifunction Application 33%

Engineering

• Optoelectronics 100%
• System-on-Package 100%
• Passive Component 66%
• Nanoscale 33%
• Radio Frequency 33%
• Integrated System 33%
• Passive Device 33%
• Active Device 33%
• Printed Circuit Board 33%
• Building Block 33%
• Buffer Layer 33%
• Optical Performance 33%
• Digital Frequency 33%
• Polymer Surface 33%
• Fabrication Time 33%
• LSI Circuits 33%
• Photometer 33%

Material Science

• Density 100%
• Buffer Layer 100%
• Optical Device 100%
• Surface (Surface Science) 100%
• Photosensor 100%