Chip-to-chip optoelectronics SOP on organic boards or packages

Gee Kung Chang, Daniel Guidotti, Fuhan Liu, Yin Jung Chang, Zhaoran Huang, Venkatesh Sundaram, Devarajan Balaraman, Shashikant Hegde, Rao R. Tummala

研究成果: 雜誌貢獻期刊論文同行評審

31 引文 斯高帕斯(Scopus)


In this paper, we demonstrate compatibility of hybrid, large-scale integration of both active and passive devices and components onto standard printed wiring boards in order to address mixed signal system-on-package (SOP)-based systems and applications. Fabrication, integration and characterization of high density passive components are presented, which includes the first time fabrication on FR-4 boards of a polymer buffer layer with nano scale local smoothness, blazed polymer surface relief gratings recorded by incoherent illumination, arrays of polymer micro lenses, and embedded bare die commercial p-i-n photodetectors. These embedded optical components are the essential building blocks toward a highly integrated SOP technology. The effort in this research demonstrates the potential for merging high-performance optical functions with traditional digital and radio frequency (RF) electronics onto large area and low-cost manufacturing methodologies for multifunction applications.

頁(從 - 到)386-397
期刊IEEE Transactions on Advanced Packaging
出版狀態已出版 - 5月 2004


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