Chip-level 10-Gbit/s optical interconnects using 1 × 2 polymer vertical splitter on silicon substrate

Chin Ta Chen; Po Kuan Shen; Teng Zhang Zhu; Chia Chi Chang; Shu Shuan Lin; Mao Yuan Zeng; Chien Yu Chiu; Hsu Liang Hsiao; Hsiao Chin Lan; Yun Chih Lee; Yo Shen Lin; Mount Learn Wu

doi:10.1364/ofc.2014.m2k.4

Chip-level 10-Gbit/s optical interconnects using 1 × 2 polymer vertical splitter on silicon substrate

Chin Ta Chen, Po Kuan Shen, Teng Zhang Zhu, Chia Chi Chang, Shu Shuan Lin, Mao Yuan Zeng, Chien Yu Chiu, Hsu Liang Hsiao, Hsiao Chin Lan, Yun Chih Lee, Yo Shen Lin, Mount Learn Wu

電機工程學系

研究成果: 書貢獻/報告類型 › 會議論文篇章 › 同行評審

摘要

The chip-level 10-Gbit/s optical interconnects with the BER better than 10-12 using the 1 × 2 polymer vertical splitter, which is composed of a polymer waveguide and three silicon 45° reflectors is demonstrated.

原文	???core.languages.en_GB???
主出版物標題	Optical Fiber Communication Conference, OFC 2014
發行者	Optical Society of America (OSA)
ISBN（電子）	9781557529930
DOIs	https://doi.org/10.1364/ofc.2014.m2k.4
出版狀態	已出版 - 3 3月 2014
事件	Optical Fiber Communication Conference, OFC 2014 - San Francisco, United States 持續時間: 9 3月 2014 → 13 3月 2014

出版系列

名字	Optical Fiber Communication Conference, OFC 2014

???event.eventtypes.event.conference???

???event.eventtypes.event.conference???	Optical Fiber Communication Conference, OFC 2014
國家/地區	United States
城市	San Francisco
期間	9/03/14 → 13/03/14

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10.1364/ofc.2014.m2k.4

引用此

Chen, C. T., Shen, P. K., Zhu, T. Z., Chang, C. C., Lin, S. S., Zeng, M. Y., Chiu, C. Y., Hsiao, H. L., Lan, H. C., Lee, Y. C., Lin, Y. S., & Wu, M. L. (2014). Chip-level 10-Gbit/s optical interconnects using 1 × 2 polymer vertical splitter on silicon substrate. 於 Optical Fiber Communication Conference, OFC 2014 (Optical Fiber Communication Conference, OFC 2014). Optical Society of America (OSA). https://doi.org/10.1364/ofc.2014.m2k.4

@inproceedings{75890cc954bf49d68211b47b7c0bfda4,

title = "Chip-level 10-Gbit/s optical interconnects using 1 × 2 polymer vertical splitter on silicon substrate",

abstract = "The chip-level 10-Gbit/s optical interconnects with the BER better than 10-12 using the 1 × 2 polymer vertical splitter, which is composed of a polymer waveguide and three silicon 45° reflectors is demonstrated.",

author = "Chen, {Chin Ta} and Shen, {Po Kuan} and Zhu, {Teng Zhang} and Chang, {Chia Chi} and Lin, {Shu Shuan} and Zeng, {Mao Yuan} and Chiu, {Chien Yu} and Hsiao, {Hsu Liang} and Lan, {Hsiao Chin} and Lee, {Yun Chih} and Lin, {Yo Shen} and Wu, {Mount Learn}",

year = "2014",

month = mar,

day = "3",

doi = "10.1364/ofc.2014.m2k.4",

language = "???core.languages.en_GB???",

series = "Optical Fiber Communication Conference, OFC 2014",

publisher = "Optical Society of America (OSA)",

booktitle = "Optical Fiber Communication Conference, OFC 2014",

note = "Optical Fiber Communication Conference, OFC 2014 ; Conference date: 09-03-2014 Through 13-03-2014",

}

Chen, CT, Shen, PK, Zhu, TZ, Chang, CC, Lin, SS, Zeng, MY, Chiu, CY, Hsiao, HL, Lan, HC, Lee, YC, Lin, YS & Wu, ML 2014, Chip-level 10-Gbit/s optical interconnects using 1 × 2 polymer vertical splitter on silicon substrate. 於 Optical Fiber Communication Conference, OFC 2014. Optical Fiber Communication Conference, OFC 2014, Optical Society of America (OSA), Optical Fiber Communication Conference, OFC 2014, San Francisco, United States, 9/03/14. https://doi.org/10.1364/ofc.2014.m2k.4

Chip-level 10-Gbit/s optical interconnects using 1 × 2 polymer vertical splitter on silicon substrate. / Chen, Chin Ta; Shen, Po Kuan; Zhu, Teng Zhang 等.
Optical Fiber Communication Conference, OFC 2014. Optical Society of America (OSA), 2014. (Optical Fiber Communication Conference, OFC 2014).

研究成果: 書貢獻/報告類型 › 會議論文篇章 › 同行評審

TY - GEN

T1 - Chip-level 10-Gbit/s optical interconnects using 1 × 2 polymer vertical splitter on silicon substrate

AU - Chen, Chin Ta

AU - Shen, Po Kuan

AU - Zhu, Teng Zhang

AU - Chang, Chia Chi

AU - Lin, Shu Shuan

AU - Zeng, Mao Yuan

AU - Chiu, Chien Yu

AU - Hsiao, Hsu Liang

AU - Lan, Hsiao Chin

AU - Lee, Yun Chih

AU - Lin, Yo Shen

AU - Wu, Mount Learn

PY - 2014/3/3

Y1 - 2014/3/3

N2 - The chip-level 10-Gbit/s optical interconnects with the BER better than 10-12 using the 1 × 2 polymer vertical splitter, which is composed of a polymer waveguide and three silicon 45° reflectors is demonstrated.

AB - The chip-level 10-Gbit/s optical interconnects with the BER better than 10-12 using the 1 × 2 polymer vertical splitter, which is composed of a polymer waveguide and three silicon 45° reflectors is demonstrated.

UR - http://www.scopus.com/inward/record.url?scp=85087240143&partnerID=8YFLogxK

U2 - 10.1364/ofc.2014.m2k.4

DO - 10.1364/ofc.2014.m2k.4

M3 - 會議論文篇章

AN - SCOPUS:85087240143

T3 - Optical Fiber Communication Conference, OFC 2014

BT - Optical Fiber Communication Conference, OFC 2014

PB - Optical Society of America (OSA)

T2 - Optical Fiber Communication Conference, OFC 2014

Y2 - 9 March 2014 through 13 March 2014

ER -

Chip-level 10-Gbit/s optical interconnects using 1 × 2 polymer vertical splitter on silicon substrate

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