摘要
The chip-level 12 optical interconnects using the polymer vertical splitter developed on a silicon substrate are demonstrated. The 12 vertical-splitting configuration is realized using a polymer waveguide terminated at three silicon 45̂ reflectors. The high-frequency transmission lines combined with the indium solder bumps are developed to flip-chip assemble a vertical-cavity surface-emitting laser chip at the input port and two photodetector chips at two output ports. Total transmission loss of-3.26 dB with a splitting ratio of 1 : 1 for the proposed splitter is experimentally obtained. A 10-Gbit/s data transmission with bit error rates better than 10 -12 for two output ports is achieved. It reveals that such chip-level 12 optical interconnects using the polymer vertical splitter are suitable for high-speed data transmission with multiple output ports.
原文 | ???core.languages.en_GB??? |
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文章編號 | 6746668 |
期刊 | IEEE Photonics Journal |
卷 | 6 |
發行號 | 2 |
DOIs | |
出版狀態 | 已出版 - 1 4月 2014 |