Can intrafirm IT skills benefit interfirm integration and performance?

Eric T.G. Wang, Frank K.Y. Chou, Neil C.A. Lee, S. Z. Lai

研究成果: 雜誌貢獻期刊論文同行評審

25 引文 斯高帕斯(Scopus)

摘要

This study develops a model to examine whether intrafirm, hard and soft IT skills have cross-boundary effects on interfirm collaboration and integration, thus leading to better supply-chain performance. A model with eight hypotheses was developed and tested using data collected from 250 Taiwanese manufacturing firms. Seven hypotheses find empirical support. The results show that intrafirm IT skills indeed can benefit interfirm collaboration and integration and thus, supply-chain performance. Our findings suggest that the value of skilled IT professionals for interfirm integration, supply-chain performance and collaborative relationships between firms is critical for realizing that value.

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頁(從 - 到)924-938
頁數15
期刊Information and Management
51
發行號7
DOIs
出版狀態已出版 - 11月 2014

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