摘要
This study investigates the formation of Ni silicides on Si1-y C y (0≤y≤0.02) epilayers grown on Si(001). The presence of C atoms retards the growth kinetics of NiSi and significantly enhances the thermal stability of NiSi thin films. In particular, an abnormal redistribution of C atoms in the NiSi thin films was observed during Ni silicidation. The NiSi layer was split into two sublayers by an obvious pileup of C atoms. This study proposes a mechanism to elucidate this phenomenon in terms of the C solubility. C atoms accumulated at the NiSi/ Si1-y Cy interfaces and NiSi grain boundaries may act as diffusion barriers, effectively hindering the grain growth and agglomeration of NiSi and extending the process window of low resistivity NiSi silicides.
原文 | ???core.languages.en_GB??? |
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頁(從 - 到) | H297-H300 |
期刊 | Journal of the Electrochemical Society |
卷 | 157 |
發行號 | 3 |
DOIs | |
出版狀態 | 已出版 - 2010 |