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Bridging micro nature with macro behaviors for granular thermal mechanics
Cheng Chuan Lin, Ling Xuan Meng,
Chih Ang Chung
,
Yun Chi Chung
機械工程學系
研究成果
:
雜誌貢獻
›
期刊論文
›
同行評審
1
引文 斯高帕斯（Scopus）
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Keyphrases
Thermal Mechanics
100%
Granular Heat Transfer
100%
Granular Materials
50%
Face-centered Cubic
50%
Stress Tensor
50%
Discrete Element Modeling
50%
Body-centered Cubic
50%
Hexagonal Close-packed
50%
Simple Cubic
50%
Heat Transfer Model
50%
Intergranular Stress
50%
Apparent Thermal Conductivity
50%
Tensor Model
50%
Numerical Results
25%
Solid Volume Fraction
25%
Discrete Element Method
25%
Numerical Solution
25%
Interparticle Interactions
25%
Granular Assembly
25%
Packing Mode
25%
Monodisperse
25%
Crystal Configuration
25%
Mechanical Response
25%
Heat Transfer Performance
25%
Finite Element Solution
25%
Packing Structure
25%
Saint-Venant Equations
25%
Benchmark Testing
25%
Thermal Response
25%
Bond Stress
25%
Contact Area
25%
Continuum Model
25%
Micro-properties
25%
Bonding Model
25%
Heat Transfer Properties
25%
Model Elements
25%
Macroscopic Properties
25%
Continuum Medium
25%
Coordination Solid
25%
Discontinuum
25%
Level Characteristic Values
25%
Microscale Heat Transfer
25%
Macro-properties
25%
Random Packing
25%
High Coordination number
25%
Engineering
Thermal Conductivity
100%
Face-Centered Cubic
100%
Discrete Element
100%
Bridging
100%
Body-Centered Cubic
100%
Heat Transfer Model
100%
Hexagonal Close
100%
Contact Bonding
100%
Rationality
50%
Numerical Solution
50%
Finite Element Solution
50%
Saint-Venant Principle
50%
Particle Contact
50%
Contact Area
50%
Discrete Element Model
50%
Model Element
50%
Microlevel
50%
Macroscopic Property
50%
Boundary Condition
50%
Microscale Heat Transfer
50%
Chemical Engineering
Thermal Conductivity
100%
Heat Conduction
50%