Bonding of thermoplastic polymer microfluidics

Chia Wen Tsao, Don L. DeVoe

研究成果: 雜誌貢獻回顧評介論文同行評審

518 引文 斯高帕斯(Scopus)

摘要

Thermoplastics are highly attractive substrate materials for microfluidic systems, with important benefits in the development of low cost disposable devices for a host of bioanalytical applications. While significant research activity has been directed towards the formation of microfluidic components in a wide range of thermoplastics, sealing of these components is required for the formation of enclosed microchannels and other microfluidic elements, and thus bonding remains a critical step in any thermoplastic microfabrication process. Unlike silicon and glass, the diverse material properties of thermoplastics opens the door to an extensive array of substrate bonding options, together with a set of unique challenges which must be addressed to achieve optimal sealing results. In this paper we review the range of techniques developed for sealing thermoplastic microfluidics and discuss a number of practical issues surrounding these various bonding methods.

原文???core.languages.en_GB???
頁(從 - 到)1-16
頁數16
期刊Microfluidics and Nanofluidics
6
發行號1
DOIs
出版狀態已出版 - 2009

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