摘要
This paper describes a microspeaker (composed of a mechanically polished PZT bimorph diaphragm and bulk-micromachined silicon top cover) that shows flat diaphragm displacement from DC to 16kHz. The microspeaker with an encapsulating cylindrical package of about 0.5cc inside volume produces sound pressure level (SPL) of 103.6 ~ 110 dB between 1.3 and 12 kHz when measured 5 mm away from the diaphragm with 190Vpeak-topeak sinusoidal driving signal. Copyright
原文 | ???core.languages.en_GB??? |
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頁面 | 1764-1784 |
頁數 | 21 |
出版狀態 | 已出版 - 2010 |
事件 | International Conference and Exhibition on Device Packaging 2010, Held in Conjunction with the Spring Conference on Global Business Council, GBC 2010 - Scottsdale and Fountain Hills, AZ, United States 持續時間: 8 3月 2010 → 11 3月 2010 |
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???event.eventtypes.event.conference??? | International Conference and Exhibition on Device Packaging 2010, Held in Conjunction with the Spring Conference on Global Business Council, GBC 2010 |
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國家/地區 | United States |
城市 | Scottsdale and Fountain Hills, AZ |
期間 | 8/03/10 → 11/03/10 |