Barrier property of a Ta/MnSixOy Layer formed by a ta-mn alloy for a cu interconnect

Cheng Lun Hsin, Kun Yen Lin

研究成果: 雜誌貢獻期刊論文同行評審

5 引文 斯高帕斯(Scopus)

指紋

深入研究「Barrier property of a Ta/MnSixOy Layer formed by a ta-mn alloy for a cu interconnect」主題。共同形成了獨特的指紋。

Engineering & Materials Science

Chemical Compounds