Automatic Inspection for Wafer Defect Pattern Recognition with Unsupervised Clustering

Katherine Shu Min Li, Leon Li-Yang Chen, Ken Chau Cheung Cheng, Peter Yi-Yu Liao, Sying Jyan Wang, Andrew Yi An Huang, Nova Tsai, Leon Chou, Gus Chang Hung Han, Jwu-E Chen, Hsing Chung Liang, Chun Lung Hsu

研究成果: 書貢獻/報告類型會議論文篇章同行評審

1 引文 斯高帕斯(Scopus)

摘要

we propose an automatic wafer defect maps detection method based on unsupervised learning. There is no need for human labeling, and similar defect clusters are identified automatically without human intervention. As a result, the process is less error-prone. Whenever the wafer test result of a WUT is available, it can be compared immediately with existing clusters. If the wafer map matches one of the known defect patterns, then RCA can be done efficiently.

原文???core.languages.en_GB???
主出版物標題Proceedings - 2021 IEEE European Test Symposium, ETS 2021
發行者Institute of Electrical and Electronics Engineers Inc.
ISBN(電子)9781665418492
DOIs
出版狀態已出版 - 24 5月 2021
事件26th IEEE European Test Symposium, ETS 2021 - Virtual, Bruges, Belgium
持續時間: 24 5月 202128 5月 2021

出版系列

名字Proceedings of the European Test Workshop
2021-May
ISSN(列印)1530-1877
ISSN(電子)1558-1780

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???event.eventtypes.event.conference???26th IEEE European Test Symposium, ETS 2021
國家/地區Belgium
城市Virtual, Bruges
期間24/05/2128/05/21

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