Automatic Inspection for Wafer Defect Pattern Recognition with Unsupervised Clustering

Katherine Shu Min Li, Leon Li-Yang Chen, Ken Chau Cheung Cheng, Peter Yi-Yu Liao, Sying Jyan Wang, Andrew Yi An Huang, Nova Tsai, Leon Chou, Gus Chang Hung Han, Jwu E. Chen, Hsing Chung Liang, Chun Lung Hsu

研究成果: 書貢獻/報告類型會議論文篇章同行評審

摘要

we propose an automatic wafer defect maps detection method based on unsupervised learning. There is no need for human labeling, and similar defect clusters are identified automatically without human intervention. As a result, the process is less error-prone. Whenever the wafer test result of a WUT is available, it can be compared immediately with existing clusters. If the wafer map matches one of the known defect patterns, then RCA can be done efficiently.

原文???core.languages.en_GB???
主出版物標題Proceedings - 2021 IEEE European Test Symposium, ETS 2021
發行者Institute of Electrical and Electronics Engineers Inc.
ISBN(電子)9781665418492
DOIs
出版狀態已出版 - 24 5月 2021
事件26th IEEE European Test Symposium, ETS 2021 - Virtual, Bruges, Belgium
持續時間: 24 5月 202128 5月 2021

出版系列

名字Proceedings of the European Test Workshop
2021-May
ISSN(列印)1530-1877
ISSN(電子)1558-1780

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???event.eventtypes.event.conference???26th IEEE European Test Symposium, ETS 2021
國家/地區Belgium
城市Virtual, Bruges
期間24/05/2128/05/21

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