Asymmetrical solder microstructure in Ni/Sn/Cu solder joint

S. J. Wang, C. Y. Liu

研究成果: 雜誌貢獻期刊論文同行評審

45 引文 斯高帕斯(Scopus)

摘要

Asymmetrical solder microstructure was observed in the Ni/Sn/Cu solder joint. The asymmetrical solder microstructure resulted from the Cu concentration gradient along the Ni/Sn/Cu solder joint. Mechanical tests showed that the mechanical property of the Ni/Sn/Cu solder joint is highly correlated with the asymmetrical solder microstructure.

原文???core.languages.en_GB???
頁(從 - 到)347-350
頁數4
期刊Scripta Materialia
55
發行號4
DOIs
出版狀態已出版 - 8月 2006

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