Asymmetrical solder microstructure in Ni/Sn/Cu solder joint

S. J. Wang; C. Y. Liu

doi:10.1016/j.scriptamat.2006.04.027

Asymmetrical solder microstructure in Ni/Sn/Cu solder joint

S. J. Wang, C. Y. Liu

化學工程與材料工程學系

研究成果: 雜誌貢獻 › 期刊論文 › 同行評審

46 引文斯高帕斯（Scopus）

摘要

Asymmetrical solder microstructure was observed in the Ni/Sn/Cu solder joint. The asymmetrical solder microstructure resulted from the Cu concentration gradient along the Ni/Sn/Cu solder joint. Mechanical tests showed that the mechanical property of the Ni/Sn/Cu solder joint is highly correlated with the asymmetrical solder microstructure.

原文	???core.languages.en_GB???
頁（從 - 到）	347-350
頁數	4
期刊	Scripta Materialia
卷	55
發行號	4
DOIs	https://doi.org/10.1016/j.scriptamat.2006.04.027
出版狀態	已出版 - 8月 2006

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10.1016/j.scriptamat.2006.04.027

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title = "Asymmetrical solder microstructure in Ni/Sn/Cu solder joint",

abstract = "Asymmetrical solder microstructure was observed in the Ni/Sn/Cu solder joint. The asymmetrical solder microstructure resulted from the Cu concentration gradient along the Ni/Sn/Cu solder joint. Mechanical tests showed that the mechanical property of the Ni/Sn/Cu solder joint is highly correlated with the asymmetrical solder microstructure.",

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AB - Asymmetrical solder microstructure was observed in the Ni/Sn/Cu solder joint. The asymmetrical solder microstructure resulted from the Cu concentration gradient along the Ni/Sn/Cu solder joint. Mechanical tests showed that the mechanical property of the Ni/Sn/Cu solder joint is highly correlated with the asymmetrical solder microstructure.

KW - Packaging

KW - Solder

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M3 - 期刊論文

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Asymmetrical solder microstructure in Ni/Sn/Cu solder joint

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