Anti-oxidative copper nanoparticles and their conductive assembly sintered at room temperature

Cyuan Jhang Wu; Shih Ming Chen; Yu Jane Sheng; Heng Kwong Tsao

doi:10.1016/j.jtice.2014.05.002

Anti-oxidative copper nanoparticles and their conductive assembly sintered at room temperature

Cyuan Jhang Wu, Shih Ming Chen, Yu Jane Sheng, Heng Kwong Tsao

化學工程與材料工程學系

研究成果: 雜誌貢獻 › 期刊論文 › 同行評審

22 引文斯高帕斯（Scopus）

摘要

Copper nanoparticles (CuNPs) can be used as conductive inks for flexible electronics but it suffers low oxidation resistance. After reduction, CuNPs with 40. nm diameter are formed and stabilized by a capping agent. By adding oxygen scavenger, CuNPs become anti-oxidative and can be stored in an ambient condition for at least 10 months. After dilution and centrifugation, the capping agent is removed and CuNP aggregates are obtained. According to field-emission scanning electron microscopy and resistivity, CuNPs are weakly sintered by pressure difference at room temperature and therefore furnish resistivity greater than the typical value of copper. The resistivity of CuNP assemblies is insensitive to the degree of sintering which is increased by annealing.

原文	???core.languages.en_GB???
頁（從 - 到）	2719-2724
頁數	6
期刊	Journal of the Taiwan Institute of Chemical Engineers
卷	45
發行號	5
DOIs	https://doi.org/10.1016/j.jtice.2014.05.002
出版狀態	已出版 - 2014

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10.1016/j.jtice.2014.05.002

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title = "Anti-oxidative copper nanoparticles and their conductive assembly sintered at room temperature",

abstract = "Copper nanoparticles (CuNPs) can be used as conductive inks for flexible electronics but it suffers low oxidation resistance. After reduction, CuNPs with 40. nm diameter are formed and stabilized by a capping agent. By adding oxygen scavenger, CuNPs become anti-oxidative and can be stored in an ambient condition for at least 10 months. After dilution and centrifugation, the capping agent is removed and CuNP aggregates are obtained. According to field-emission scanning electron microscopy and resistivity, CuNPs are weakly sintered by pressure difference at room temperature and therefore furnish resistivity greater than the typical value of copper. The resistivity of CuNP assemblies is insensitive to the degree of sintering which is increased by annealing.",

keywords = "Anti-oxidative, Copper nanoparticles, Sintering at room temperature",

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T1 - Anti-oxidative copper nanoparticles and their conductive assembly sintered at room temperature

AU - Wu, Cyuan Jhang

AU - Chen, Shih Ming

AU - Sheng, Yu Jane

AU - Tsao, Heng Kwong

PY - 2014

Y1 - 2014

N2 - Copper nanoparticles (CuNPs) can be used as conductive inks for flexible electronics but it suffers low oxidation resistance. After reduction, CuNPs with 40. nm diameter are formed and stabilized by a capping agent. By adding oxygen scavenger, CuNPs become anti-oxidative and can be stored in an ambient condition for at least 10 months. After dilution and centrifugation, the capping agent is removed and CuNP aggregates are obtained. According to field-emission scanning electron microscopy and resistivity, CuNPs are weakly sintered by pressure difference at room temperature and therefore furnish resistivity greater than the typical value of copper. The resistivity of CuNP assemblies is insensitive to the degree of sintering which is increased by annealing.

AB - Copper nanoparticles (CuNPs) can be used as conductive inks for flexible electronics but it suffers low oxidation resistance. After reduction, CuNPs with 40. nm diameter are formed and stabilized by a capping agent. By adding oxygen scavenger, CuNPs become anti-oxidative and can be stored in an ambient condition for at least 10 months. After dilution and centrifugation, the capping agent is removed and CuNP aggregates are obtained. According to field-emission scanning electron microscopy and resistivity, CuNPs are weakly sintered by pressure difference at room temperature and therefore furnish resistivity greater than the typical value of copper. The resistivity of CuNP assemblies is insensitive to the degree of sintering which is increased by annealing.

KW - Anti-oxidative

KW - Copper nanoparticles

KW - Sintering at room temperature

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M3 - 期刊論文

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JO - Journal of the Taiwan Institute of Chemical Engineers

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Anti-oxidative copper nanoparticles and their conductive assembly sintered at room temperature

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