An ultra-high-density 256-channel/25mm2 neural sensing microsystem using TSV-embedded neural probes

Yu Chieh Huang; Po Tsang Huang; Shang Lin Wu; Yu Chen Hu; Yan Huei You; Ming Chen; Yan Yu Huang; Hsiao Chun Chang; Yen Han Lin; Jeng Ren Duann; Tzai Wen Chiu; Wei Hwang; Kuan Neng Chen; Ching Te Chuang; Jin Chern Chiou

doi:10.1109/ISCAS.2016.7527487

An ultra-high-density 256-channel/25mm2 neural sensing microsystem using TSV-embedded neural probes

Yu Chieh Huang, Po Tsang Huang, Shang Lin Wu, Yu Chen Hu, Yan Huei You, Ming Chen, Yan Yu Huang, Hsiao Chun Chang, Yen Han Lin, Jeng Ren Duann, Tzai Wen Chiu, Wei Hwang, Kuan Neng Chen, Ching Te Chuang, Jin Chern Chiou

認知神經科學研究所

研究成果: 書貢獻/報告類型 › 會議論文篇章 › 同行評審

5 引文斯高帕斯（Scopus）

摘要

Highly integrated neural sensing microsystems are crucial to capture accurate signals for brain function investigations. In this paper, a 256-channel/25 mm2 neural sensing microsystem is presented based on through-silicon-via (TSV) 2.5D integration. This microsystem composes of dissolvable μ-needles, TSV-embedded μ-probes, 256-channel neural amplifiers, 11-bit area-power-efficient SAR ADCs and serializers. Based on the dissolvable μ-needles and TSV 2.5D integration, this microsystem can detect 256 ECoG/LFP signals within the small area of 5mm × 5mm. Additionally, the neural amplifier realizes 57.8dB gain with only 9.8μW for each channel, and the 9.7-bit ENOB of the SAR ADC at 32kS/s can be achieved with 0.42μW and 0.036 mm2. The overall power of this microsystem is only 3.79mW for 256-channel neural sensing.

原文	???core.languages.en_GB???
主出版物標題	ISCAS 2016 - IEEE International Symposium on Circuits and Systems
發行者	Institute of Electrical and Electronics Engineers Inc.
頁面	1302-1305
頁數	4
ISBN（電子）	9781479953400
DOIs	https://doi.org/10.1109/ISCAS.2016.7527487
出版狀態	已出版 - 29 7月 2016
事件	2016 IEEE International Symposium on Circuits and Systems, ISCAS 2016 - Montreal, Canada 持續時間: 22 5月 2016 → 25 5月 2016

出版系列

名字	Proceedings - IEEE International Symposium on Circuits and Systems
卷	2016-July
ISSN（列印）	0271-4310

???event.eventtypes.event.conference???

???event.eventtypes.event.conference???	2016 IEEE International Symposium on Circuits and Systems, ISCAS 2016
國家/地區	Canada
城市	Montreal
期間	22/05/16 → 25/05/16

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10.1109/ISCAS.2016.7527487

引用此

Huang, Y. C., Huang, P. T., Wu, S. L., Hu, Y. C., You, Y. H., Chen, M., Huang, Y. Y., Chang, H. C., Lin, Y. H., Duann, J. R., Chiu, T. W., Hwang, W., Chen, K. N., Chuang, C. T., & Chiou, J. C. (2016). An ultra-high-density 256-channel/25mm2 neural sensing microsystem using TSV-embedded neural probes. 於 ISCAS 2016 - IEEE International Symposium on Circuits and Systems (頁 1302-1305). 文章 7527487 (Proceedings - IEEE International Symposium on Circuits and Systems; 卷 2016-July). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISCAS.2016.7527487

Huang, Yu Chieh ; Huang, Po Tsang ; Wu, Shang Lin 等. / An ultra-high-density 256-channel/25mm2 neural sensing microsystem using TSV-embedded neural probes. ISCAS 2016 - IEEE International Symposium on Circuits and Systems. Institute of Electrical and Electronics Engineers Inc., 2016. 頁 1302-1305 (Proceedings - IEEE International Symposium on Circuits and Systems).

@inproceedings{fcd246244c274a50bce65ab25e7b8f8c,

title = "An ultra-high-density 256-channel/25mm2 neural sensing microsystem using TSV-embedded neural probes",

abstract = "Highly integrated neural sensing microsystems are crucial to capture accurate signals for brain function investigations. In this paper, a 256-channel/25 mm2 neural sensing microsystem is presented based on through-silicon-via (TSV) 2.5D integration. This microsystem composes of dissolvable μ-needles, TSV-embedded μ-probes, 256-channel neural amplifiers, 11-bit area-power-efficient SAR ADCs and serializers. Based on the dissolvable μ-needles and TSV 2.5D integration, this microsystem can detect 256 ECoG/LFP signals within the small area of 5mm × 5mm. Additionally, the neural amplifier realizes 57.8dB gain with only 9.8μW for each channel, and the 9.7-bit ENOB of the SAR ADC at 32kS/s can be achieved with 0.42μW and 0.036 mm2. The overall power of this microsystem is only 3.79mW for 256-channel neural sensing.",

author = "Huang, {Yu Chieh} and Huang, {Po Tsang} and Wu, {Shang Lin} and Hu, {Yu Chen} and You, {Yan Huei} and Ming Chen and Huang, {Yan Yu} and Chang, {Hsiao Chun} and Lin, {Yen Han} and Duann, {Jeng Ren} and Chiu, {Tzai Wen} and Wei Hwang and Chen, {Kuan Neng} and Chuang, {Ching Te} and Chiou, {Jin Chern}",

note = "Publisher Copyright: {\textcopyright} 2016 IEEE.; 2016 IEEE International Symposium on Circuits and Systems, ISCAS 2016 ; Conference date: 22-05-2016 Through 25-05-2016",

year = "2016",

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doi = "10.1109/ISCAS.2016.7527487",

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series = "Proceedings - IEEE International Symposium on Circuits and Systems",

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Huang, YC, Huang, PT, Wu, SL, Hu, YC, You, YH, Chen, M, Huang, YY, Chang, HC, Lin, YH, Duann, JR, Chiu, TW, Hwang, W, Chen, KN, Chuang, CT & Chiou, JC 2016, An ultra-high-density 256-channel/25mm2 neural sensing microsystem using TSV-embedded neural probes. 於 ISCAS 2016 - IEEE International Symposium on Circuits and Systems., 7527487, Proceedings - IEEE International Symposium on Circuits and Systems, 卷 2016-July, Institute of Electrical and Electronics Engineers Inc., 頁 1302-1305, 2016 IEEE International Symposium on Circuits and Systems, ISCAS 2016, Montreal, Canada, 22/05/16. https://doi.org/10.1109/ISCAS.2016.7527487

An ultra-high-density 256-channel/25mm2 neural sensing microsystem using TSV-embedded neural probes. / Huang, Yu Chieh; Huang, Po Tsang; Wu, Shang Lin 等.
ISCAS 2016 - IEEE International Symposium on Circuits and Systems. Institute of Electrical and Electronics Engineers Inc., 2016. p. 1302-1305 7527487 (Proceedings - IEEE International Symposium on Circuits and Systems; 卷 2016-July).

研究成果: 書貢獻/報告類型 › 會議論文篇章 › 同行評審

TY - GEN

T1 - An ultra-high-density 256-channel/25mm2 neural sensing microsystem using TSV-embedded neural probes

AU - Huang, Yu Chieh

AU - Huang, Po Tsang

AU - Wu, Shang Lin

AU - Hu, Yu Chen

AU - You, Yan Huei

AU - Chen, Ming

AU - Huang, Yan Yu

AU - Chang, Hsiao Chun

AU - Lin, Yen Han

AU - Duann, Jeng Ren

AU - Chiu, Tzai Wen

AU - Hwang, Wei

AU - Chen, Kuan Neng

AU - Chuang, Ching Te

AU - Chiou, Jin Chern

PY - 2016/7/29

Y1 - 2016/7/29

N2 - Highly integrated neural sensing microsystems are crucial to capture accurate signals for brain function investigations. In this paper, a 256-channel/25 mm2 neural sensing microsystem is presented based on through-silicon-via (TSV) 2.5D integration. This microsystem composes of dissolvable μ-needles, TSV-embedded μ-probes, 256-channel neural amplifiers, 11-bit area-power-efficient SAR ADCs and serializers. Based on the dissolvable μ-needles and TSV 2.5D integration, this microsystem can detect 256 ECoG/LFP signals within the small area of 5mm × 5mm. Additionally, the neural amplifier realizes 57.8dB gain with only 9.8μW for each channel, and the 9.7-bit ENOB of the SAR ADC at 32kS/s can be achieved with 0.42μW and 0.036 mm2. The overall power of this microsystem is only 3.79mW for 256-channel neural sensing.

AB - Highly integrated neural sensing microsystems are crucial to capture accurate signals for brain function investigations. In this paper, a 256-channel/25 mm2 neural sensing microsystem is presented based on through-silicon-via (TSV) 2.5D integration. This microsystem composes of dissolvable μ-needles, TSV-embedded μ-probes, 256-channel neural amplifiers, 11-bit area-power-efficient SAR ADCs and serializers. Based on the dissolvable μ-needles and TSV 2.5D integration, this microsystem can detect 256 ECoG/LFP signals within the small area of 5mm × 5mm. Additionally, the neural amplifier realizes 57.8dB gain with only 9.8μW for each channel, and the 9.7-bit ENOB of the SAR ADC at 32kS/s can be achieved with 0.42μW and 0.036 mm2. The overall power of this microsystem is only 3.79mW for 256-channel neural sensing.

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U2 - 10.1109/ISCAS.2016.7527487

DO - 10.1109/ISCAS.2016.7527487

M3 - 會議論文篇章

AN - SCOPUS:84983390773

T3 - Proceedings - IEEE International Symposium on Circuits and Systems

SP - 1302

EP - 1305

BT - ISCAS 2016 - IEEE International Symposium on Circuits and Systems

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2016 IEEE International Symposium on Circuits and Systems, ISCAS 2016

Y2 - 22 May 2016 through 25 May 2016

ER -

Huang YC, Huang PT, Wu SL, Hu YC, You YH, Chen M 等. An ultra-high-density 256-channel/25mm2 neural sensing microsystem using TSV-embedded neural probes. 於 ISCAS 2016 - IEEE International Symposium on Circuits and Systems. Institute of Electrical and Electronics Engineers Inc. 2016. p. 1302-1305. 7527487. (Proceedings - IEEE International Symposium on Circuits and Systems). doi: 10.1109/ISCAS.2016.7527487

An ultra-high-density 256-channel/25mm2 neural sensing microsystem using TSV-embedded neural probes

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