An in-situ performance test of liquid cooling for a server computer system

Chien Yuh Yang, Chun Ta Yeh, Pei Kang Wang, Wei Chi Liu, Edward Yu Chun Kung

研究成果: 書貢獻/報告類型會議論文篇章同行評審

3 引文 斯高帕斯(Scopus)

摘要

An IBM power series server x3350 was tested by using the liquid cooling system developed by Yang et al. [3, 4, 5]. The performance of the heat pipe based direct air cooling system equipped in the original server was also tested for comparison. Both CPU core temperature and cooling system noise level were measured in the present test. he test results of liquid cooling and direct air cooling show that the maximum average core temperature to air temperature difference (at 100% CPU loading condition) is 46.5°C for IBM original direct air cooling but only 24.8°C for liquid cooling at heat sink fan speed of 2200 rpm. At which the noise level is 59.5 and 49.5 dB respectively. While reduced the heat sink fan speed of the liquid cooling system to 1080 rpm, the core to air temperature difference slightly increased to 28.4°C, but the noise level reduced to 36.5 dB. The liquid cooling system required only 1/5 to 1/3.5 of power of the direct air cooling did. These results indicated that the liquid cooling system provides much higher cooling performance but lower noise and lower power consumption than the direct air cooling system for high power server.

原文???core.languages.en_GB???
主出版物標題International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings
DOIs
出版狀態已出版 - 2010
事件2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference - Taipei, Taiwan
持續時間: 20 10月 201022 10月 2010

出版系列

名字International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings

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???event.eventtypes.event.conference???2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference
國家/地區Taiwan
城市Taipei
期間20/10/1022/10/10

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