An electrical testing method for blind through silicon vias (TSVs) for 3D IC integration

Shyh Shyuan Sheu, Zhe Hui Lin, Jui Feng Hung, John H. Lau, Peng Shu Chen, Shih Hsien Wu, Keng Li Su, Chih Sheng Lin, Shinn Juh Lai, Kuo Hsing Cheng, Tzu Kun Ku, Wei Chung Lo, Ming Jer Kao

研究成果: 雜誌貢獻期刊論文同行評審

6 引文 斯高帕斯(Scopus)

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Engineering & Materials Science

Chemical Compounds