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An atmospheric-pressure plasma process for C
2
F
6
removal
Moo Been Chang
, Sheng Jen Yu
環境監測技術聯合中心
土木工程學系
環境工程研究所
研究成果
:
雜誌貢獻
›
期刊論文
›
同行評審
53
引文 斯高帕斯（Scopus）
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深入研究「An atmospheric-pressure plasma process for C
2
F
6
removal」主題。共同形成了獨特的指紋。
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Engineering
Applied Voltage
33%
Atmospheric Pressure
100%
Chemical Vapor Deposition
33%
Dielectrics
100%
Experimental Result
100%
Gas Streams
33%
Infrared Radiation
33%
Plasma Applications
33%
Plasma Process
100%
Pressure Plasma
100%
Removal Efficiency
66%
Vapor Deposition
33%
Physics
Atmospheric Pressure
100%
Blood Plasma
66%
Carbon Dioxide
33%
Dielectric Barrier Discharge
100%
Gas Streams
33%
Greenhouse Effect
33%
Infrared Radiation
33%
Plasma Etching
33%
Plasma Generator
33%
Plasma Process
100%
Rare Gas
33%
Vapor Deposition
33%
Keyphrases
Applied Voltage
14%
Atmospheric Pressure Plasma
100%
Atmospheric Pressure Plasma Processing
14%
C2F6
100%
Chemical Vapor Deposition
14%
COF2
14%
Dielectric Barrier Discharge
42%
Discharge Process
14%
Gas Stream
14%
Greenhouse Effect
14%
Inert Gas
14%
Infrared Radiation
14%
Innovative Approach
14%
Perfluoro Compounds
28%
Plasma Catalysis
28%
Plasma Chemical
14%
Plasma Etching
14%
Plasma Generation
14%
Plasma Process
100%
Removal Efficiency
28%
Semiconductor Industry
14%
Chemical Engineering
Carbon Dioxide
50%
Chemical Vapor Deposition
50%
Gas Streams
50%
Plasma Process
100%
Vapor Deposition
50%
Material Science
Carbon Dioxide
33%
Catalysis
66%
Chemical Vapor Deposition
33%
Dielectric Material
100%
Inert Gas
33%
Plasma Etching
33%