Allocation of RAM built-in self-repair circuits for SOC dies of 3D ICs

Keyphrases

• System-on-chip 100%
• Three-Dimensional ICs 100%
• Built-in Self-repair 100%
• Post-bond Test 36%
• Pre-bond 36%
• Test Power 18%
• Power Constraint 18%
• Repair Scheme 18%
• Test Sequence 18%
• Repair Time 18%
• Through Silicon via 9%
• Allocation Scheme 9%
• Repair Method 9%
• Area Reduction 9%
• Allocation Method 9%
• Modern Systems 9%
• Minimization Algorithm 9%
• Test Scheduling 9%
• Distance Constraint 9%
• Circuit Reduction 9%
• Test Distance 9%

Engineering

• System-on-Chip 100%
• Reliability Availability and Maintainability (Reliability Engineering) 100%
• Test Time 25%
• Power Constraint 25%
• Test Sequence 25%
• Repair Time 25%
• Simulation Result 12%
• Area Reduction 12%
• Modern System 12%