A study of large area die bonding materials and their corresponding mechanical and thermal properties

Te Yuan Chung; Jian Hong Jhang; Jing Sian Chen; Yi Chien Lo; Gwo Herng Ho; Mount Learn Wu; Ching Cherng Sun

doi:10.1016/j.microrel.2011.03.029

A study of large area die bonding materials and their corresponding mechanical and thermal properties

Te Yuan Chung, Jian Hong Jhang, Jing Sian Chen, Yi Chien Lo, Gwo Herng Ho, Mount Learn Wu, Ching Cherng Sun

光電科學與工程學系

研究成果: 雜誌貢獻 › 期刊論文 › 同行評審

26 引文斯高帕斯（Scopus）

摘要

We tested the ability of Au/Sn eutectic, silver paste, and solder paste to bond to a large area as well as the bonding of a high power LED die to a highly conductive submount. The samples ran through several tests including ultrasound image, shear force, and thermal resistance measurement. Finite element analysis (FEA) models were built for comparison and analysis. Au/Sn bonding shows the best thermal and mechanical properties. Silver paste shows lower contact thermal resistance compared with solder paste. Although the thickness of the silver paste bonding layer is greater than the solder paste bonding layer, the average total thermal resistance is noticeably lower than the solder paste bonded samples.

原文	???core.languages.en_GB???
頁（從 - 到）	872-877
頁數	6
期刊	Microelectronics Reliability
卷	52
發行號	5
DOIs	https://doi.org/10.1016/j.microrel.2011.03.029
出版狀態	已出版 - 5月 2012

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10.1016/j.microrel.2011.03.029

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abstract = "We tested the ability of Au/Sn eutectic, silver paste, and solder paste to bond to a large area as well as the bonding of a high power LED die to a highly conductive submount. The samples ran through several tests including ultrasound image, shear force, and thermal resistance measurement. Finite element analysis (FEA) models were built for comparison and analysis. Au/Sn bonding shows the best thermal and mechanical properties. Silver paste shows lower contact thermal resistance compared with solder paste. Although the thickness of the silver paste bonding layer is greater than the solder paste bonding layer, the average total thermal resistance is noticeably lower than the solder paste bonded samples.",

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note = "Funding Information: This research was funded by Contracts NSC-99-2623-E-008-004-ET, 100-ET-E-008-004-ET, 100-3113-E-008-001 and NSC 98-2221-E-008-014 from the National Science Council of Taiwan. ",

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AU - Wu, Mount Learn

AU - Sun, Ching Cherng

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AB - We tested the ability of Au/Sn eutectic, silver paste, and solder paste to bond to a large area as well as the bonding of a high power LED die to a highly conductive submount. The samples ran through several tests including ultrasound image, shear force, and thermal resistance measurement. Finite element analysis (FEA) models were built for comparison and analysis. Au/Sn bonding shows the best thermal and mechanical properties. Silver paste shows lower contact thermal resistance compared with solder paste. Although the thickness of the silver paste bonding layer is greater than the solder paste bonding layer, the average total thermal resistance is noticeably lower than the solder paste bonded samples.

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A study of large area die bonding materials and their corresponding mechanical and thermal properties

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