A Shared Parallel Built-In Self-Repair Scheme for Random Access Memories in SOCs

Tsu Wei Tseng, Jin Fu Li

研究成果: 書貢獻/報告類型會議論文篇章同行評審

23 引文 斯高帕斯(Scopus)

摘要

Embedded memories currently constitute a significant portion of the chip area for typical system-on-chip (SOC) designs. Built-in self-repair (BISR) techniques have been widely used for enhancing the yield of embedded memories. This paper proposes a shared parallel BISR scheme for random access memories (RAMs) in SOCs. The shared parallel BISR can test and repair multiple RAMs simultaneously. A global timemultiplexed built-in redundancy analyzer (TM-BIRA) is used to allocate redundancies of the RAMs under test and repair.We als design a 1500-compatible wrapper for chip-level control of the shared parallel BISR circuits. In comparison with the dedicated parallel BISR scheme (each memory has a self-contained BISR circuit), the proposed parallel BISR scheme can achieve 20% reduction of area cost by paying additional 0.005% test and repair time for serving 5 RAMs with spare rows and spare columns.

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主出版物標題Proceedings - International Test Conference 2008, ITC 2008
DOIs
出版狀態已出版 - 2008
事件International Test Conference 2008, ITC 2008 - Santa Clara, CA, United States
持續時間: 28 10月 200830 10月 2008

出版系列

名字Proceedings - International Test Conference
ISSN(列印)1089-3539

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???event.eventtypes.event.conference???International Test Conference 2008, ITC 2008
國家/地區United States
城市Santa Clara, CA
期間28/10/0830/10/08

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