TY - JOUR
T1 - A patterned dielectric support process for high performance passive fabrication
AU - Chen, C. C.
AU - Chen, Ssu Ying
AU - Cheng, Y. T.
N1 - Funding Information:
Manuscript received July 24, 2007; revised September 14, 2007. This work was supported in part by the National Science Council of Taiwan, R.O.C., under Grant NSC 95-2220-E-009-036 and in part by STC, ITRI. The authors are with Microsystems Integration Laboratory, Department of Electronics Engineering, National Chiao Tung University, Hsinchu, Taiwan 300, R.O.C. (e-mail: [email protected]). Color versions of one or more of the figures in this letter are available online at http://ieeexplore.ieee.org. Digital Object Identifier 10.1109/LMWC.2007.915030 Fig. 1. Comparison of experimental results between the measured losses of CPWs fabricated with and without oxide/nitride fin support on a conventional silicon substrate.
PY - 2008/2
Y1 - 2008/2
N2 - This letter presents a micromachining process to effectively reduce substrate loss via a structure of patterned oxide/nitride fins on a silicon substrate with a resistivity of 1 Ω-cm. Experimental results demonstrate that the insertion loss of a coplanar waveguide (CPW) deposited on the structure can be lowered to the value of 4.33 dB/cm at 40 GHz. Meanwhile, an analytical model is developed to predict the characteristics of the CPW.
AB - This letter presents a micromachining process to effectively reduce substrate loss via a structure of patterned oxide/nitride fins on a silicon substrate with a resistivity of 1 Ω-cm. Experimental results demonstrate that the insertion loss of a coplanar waveguide (CPW) deposited on the structure can be lowered to the value of 4.33 dB/cm at 40 GHz. Meanwhile, an analytical model is developed to predict the characteristics of the CPW.
KW - Coplanar waveguide (CPW)
KW - Effective dielectric constant
KW - Equivalent impedance
KW - Oxide/nitride fins
KW - Radio frequency integrated circuit (RFIC)
KW - Substrate loss
UR - http://www.scopus.com/inward/record.url?scp=38949120098&partnerID=8YFLogxK
U2 - 10.1109/LMWC.2007.915030
DO - 10.1109/LMWC.2007.915030
M3 - 期刊論文
AN - SCOPUS:38949120098
SN - 1531-1309
VL - 18
SP - 82
EP - 84
JO - IEEE Microwave and Wireless Components Letters
JF - IEEE Microwave and Wireless Components Letters
IS - 2
ER -