@inproceedings{b709815f9bc648d78c67c1f7ef725a04,
title = "A novel method for real-time wafer positioning during transfer process",
abstract = "This study proposed a novel method for real-time detection of wafer position on a robot blade during the transfer process. The wafer positioning system comprises two line-shaped beams spreading toward a scattefring surface on the way of wafer transfer. The images taken from a CCD (charge coupled device) camera mounted above the scattering surface are analyzed, and the instant position of the wafer center on the robot blade during the transfer process can be determined after image processing. The precision for the proposed wafer center detection is about 0.15mm according to the preliminary experimental results.",
keywords = "CCD, Image Processing, Wafer Positioning",
author = "Chen, \{Yi Cheng\} and Chen, \{Yu Pin\} and Lee, \{Ju Yi\}",
year = "2011",
language = "???core.languages.en\_GB???",
isbn = "9784907764395",
series = "Proceedings of the SICE Annual Conference",
publisher = "Society of Instrument and Control Engineers (SICE)",
pages = "1933--1937",
booktitle = "SICE 2011 - SICE Annual Conference 2011, Final Program and Abstracts",
note = "50th Annual Conference on Society of Instrument and Control Engineers, SICE 2011 ; Conference date: 13-09-2011 Through 18-09-2011",
}