A multi-step deposited AlN films in a DC pulsed sputtering and film characteristics classification with principal component analysis of OES data

Keyphrases

• Principal Coordinate Analysis (PCoA) 100%
• Residual Stress 100%
• Spectroscopic Data 100%
• Aluminum Nitride Film 100%
• Optical Emission Spectroscopy 100%
• DC Sputtering 100%
• Film Characteristics 100%
• Characteristic Classification 100%
• Microstructure 50%
• Four-step 50%
• Multistep Deposition 50%
• Residual Film 50%
• In Situ 25%
• Atomic Force Microscopy 25%
• Fourier Transform Infrared Spectroscopy (FT-IR) 25%
• Surface Roughness 25%
• Film Properties 25%
• Crystallites 25%
• Ion-induced 25%
• Microstructural Changes 25%
• Big Data Analysis 25%
• Nitrides 25%
• Grain Size 25%
• Substrate Temperature 25%
• Deposition Methods 25%
• Stress Gradient 25%
• Crystal Orientation 25%
• Plasma-enhanced Chemical Vapor Deposition (PECVD) 25%
• Microstructural Characteristics 25%
• Film Deposition 25%
• Data Preprocessing 25%
• Ion Bombardment 25%
• Microstructural Analysis 25%
• Stress Characteristics 25%
• Stress Features 25%
• Stress Property 25%
• Dominant Wavelength 25%
• Characteristic Comparison 25%
• One-step Deposition 25%
• Cross-validation Test 25%
• Gradient Control 25%
• Feature Film 25%
• Scanning Electron Microscopy, X-ray Diffraction 25%

Material Science

• Aluminum Nitride 100%
• Film 100%
• Emission Spectroscopy 100%
• Residual Stress 40%
• Crystallite 20%
• Scanning Electron Microscopy 10%
• Surface Roughness 10%
• X-Ray Diffraction 10%
• Fourier Transform Infrared Spectroscopy 10%
• Grain Size 10%
• Film Deposition 10%
• Microstructural Analysis 10%
• Plasma Deposition 10%
• Ion Bombardment 10%
• Atomic Force Microscopy 10%