A Light-Weight Neural Network for Wafer Map Classification Based on Data Augmentation

Tsung Han Tsai, Yu Chen Lee

研究成果: 雜誌貢獻期刊論文同行評審

58 引文 斯高帕斯(Scopus)

摘要

In the semiconductor industry, the testing section has always played an important role. The testing section often requires engineers to judge the defect, which wastes a lot of time and cost. The accurate classification can provide useful information for engineers through neural networks. In this paper, we present a method for wafer map data augmentation and defect classification. Data augmentation is based on CNN encoder-decoder and the classification is based on depthwise separable convolutions. There are two datasets used, one is open dataset WM-811K and the other is built with a Taiwan company. We train two models with mobilenetV1 and V2 for the different datasets. The light-weight deep convolution can reduce model parameters and calculations, which is very efficient for the testing house with large production volumes. On two different data sets, our proposed method can reduce the number of parameters by 30% and 95%, and reduce the amount of calculation by 75% and 25%, respectively. The test accuracy of the first dataset is 93.95%. The second dataset test accuracy is 87.04%. After the data augmentation, accuracy is increased to 97.01% and 95.09%, respectively.

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文章編號9153016
頁(從 - 到)663-672
頁數10
期刊IEEE Transactions on Semiconductor Manufacturing
33
發行號4
DOIs
出版狀態已出版 - 11月 2020

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