A built-in self-test scheme for the post-bond test of TSVs in 3D ICs

Yu Jen Huang, Jin Fu Li, Ji Jan Chen, Ding Ming Kwai, Yung Fa Chou, Cheng Wen Wu

研究成果: 書貢獻/報告類型會議論文篇章同行評審

70 引文 斯高帕斯(Scopus)

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Engineering & Materials Science