A built-in redundancy-analysis scheme for RAMs with 3D redundancy

Yi Ju Chang, Yu Jen Huang, Jin Fu Li

研究成果: 書貢獻/報告類型會議論文篇章同行評審

4 引文 斯高帕斯(Scopus)

摘要

Built-in self-repair (BISR) techniques have been widely used to enhance the yield of embedded memories. Built-in redundancy-analysis (BIRA) module is one key component of the BISR circuit. In this paper, we present a BIRA scheme for random access memories (RAMs) with 3D redundancy to improve the yield of RAMs with cluster faults. A RAM with 3D redundancy is equipped with spare rows, spare columns, and spare IOs. The proposed BIRA scheme also can be designed as programmable such that it can serve multiple RAMs and support the multiple-time repair to increase the repair rate further. Experimental results show that the proposed BISR scheme can achieve high repair rate and only incurs 0.4% additional area overhead, compared with an existing BIRA scheme.

原文???core.languages.en_GB???
主出版物標題Proceedings of 2011 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2011
頁面264-267
頁數4
DOIs
出版狀態已出版 - 2011
事件2011 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2011 - Hsinchu, Taiwan
持續時間: 25 4月 201128 4月 2011

出版系列

名字Proceedings of 2011 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2011

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???event.eventtypes.event.conference???2011 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2011
國家/地區Taiwan
城市Hsinchu
期間25/04/1128/04/11

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