A 64-channel wireless neural sensing microsystem with TSV-embedded micro-probe array for neural signal acquisition

Yu Chieh Huang; Po Tsang Huang; Yu Chen Hu; Shang Lin Wu; Yan Huei You; Yung Kuei Wang; Jeng Ren Duann; Tzai Wen Chiu; Wei Hwang; Kuan Neng Chen; Ching Te Chuang; Jin Chern Chiou

doi:10.1109/TRANSDUCERS.2017.7993979

A 64-channel wireless neural sensing microsystem with TSV-embedded micro-probe array for neural signal acquisition

Yu Chieh Huang, Po Tsang Huang, Yu Chen Hu, Shang Lin Wu, Yan Huei You, Yung Kuei Wang, Jeng Ren Duann, Tzai Wen Chiu, Wei Hwang, Kuan Neng Chen, Ching Te Chuang, Jin Chern Chiou

認知神經科學研究所

研究成果: 書貢獻/報告類型 › 會議論文篇章 › 同行評審

摘要

To enhance the signal integrity of high-density neural-sensing signals, this work presents an implantable high spatial resolution μ-probe array with through-silicon via (TSV) 2.5D integration technology that realizes a miniaturized implantable device on flexible printed circuit (FPC) interposer. The proposed microsystem was composed of two 32-channel neural sensing chips and one radio frequency chip for neural signal processing. The μ-probe array can achieve better signal-to-noise ratio with neural-signal acquisition and processing circuit composed of a pseudo-resistor-based analog front-end amplifier. Moreover, a receiving antenna is also implemented on the backside of FPC for wireless data and power transmission. The feasibility of the proposed μ-probe array, Tx and Rx antenna, 32-channel neural sensing circuits in the 64-channel wireless microsystem have been successfully demonstrated for future integration and animal experiments.

原文	???core.languages.en_GB???
主出版物標題	TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems
發行者	Institute of Electrical and Electronics Engineers Inc.
頁面	28-31
頁數	4
ISBN（電子）	9781538627310
DOIs	https://doi.org/10.1109/TRANSDUCERS.2017.7993979
出版狀態	已出版 - 26 7月 2017
事件	19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017 - Kaohsiung, Taiwan 持續時間: 18 6月 2017 → 22 6月 2017

出版系列

名字	TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems

???event.eventtypes.event.conference???

???event.eventtypes.event.conference???	19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017
國家/地區	Taiwan
城市	Kaohsiung
期間	18/06/17 → 22/06/17

存取文件

10.1109/TRANSDUCERS.2017.7993979

引用此

Huang, Y. C., Huang, P. T., Hu, Y. C., Wu, S. L., You, Y. H., Wang, Y. K., Duann, J. R., Chiu, T. W., Hwang, W., Chen, K. N., Chuang, C. T., & Chiou, J. C. (2017). A 64-channel wireless neural sensing microsystem with TSV-embedded micro-probe array for neural signal acquisition. 於 TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems (頁 28-31). 文章 7993979 (TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/TRANSDUCERS.2017.7993979

Huang, Yu Chieh ; Huang, Po Tsang ; Hu, Yu Chen 等. / A 64-channel wireless neural sensing microsystem with TSV-embedded micro-probe array for neural signal acquisition. TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems. Institute of Electrical and Electronics Engineers Inc., 2017. 頁 28-31 (TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems).

@inproceedings{d146618112cd43fa8a4480687076ec94,

title = "A 64-channel wireless neural sensing microsystem with TSV-embedded micro-probe array for neural signal acquisition",

abstract = "To enhance the signal integrity of high-density neural-sensing signals, this work presents an implantable high spatial resolution μ-probe array with through-silicon via (TSV) 2.5D integration technology that realizes a miniaturized implantable device on flexible printed circuit (FPC) interposer. The proposed microsystem was composed of two 32-channel neural sensing chips and one radio frequency chip for neural signal processing. The μ-probe array can achieve better signal-to-noise ratio with neural-signal acquisition and processing circuit composed of a pseudo-resistor-based analog front-end amplifier. Moreover, a receiving antenna is also implemented on the backside of FPC for wireless data and power transmission. The feasibility of the proposed μ-probe array, Tx and Rx antenna, 32-channel neural sensing circuits in the 64-channel wireless microsystem have been successfully demonstrated for future integration and animal experiments.",

keywords = "2.5 D integration, Flexible printed circuit (FPC), neural signal, through-silicon via (TSV)",

author = "Huang, {Yu Chieh} and Huang, {Po Tsang} and Hu, {Yu Chen} and Wu, {Shang Lin} and You, {Yan Huei} and Wang, {Yung Kuei} and Duann, {Jeng Ren} and Chiu, {Tzai Wen} and Wei Hwang and Chen, {Kuan Neng} and Chuang, {Ching Te} and Chiou, {Jin Chern}",

note = "Publisher Copyright: {\textcopyright} 2017 IEEE.; 19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017 ; Conference date: 18-06-2017 Through 22-06-2017",

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Huang, YC, Huang, PT, Hu, YC, Wu, SL, You, YH, Wang, YK, Duann, JR, Chiu, TW, Hwang, W, Chen, KN, Chuang, CT & Chiou, JC 2017, A 64-channel wireless neural sensing microsystem with TSV-embedded micro-probe array for neural signal acquisition. 於 TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems., 7993979, TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems, Institute of Electrical and Electronics Engineers Inc., 頁 28-31, 19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017, Kaohsiung, Taiwan, 18/06/17. https://doi.org/10.1109/TRANSDUCERS.2017.7993979

A 64-channel wireless neural sensing microsystem with TSV-embedded micro-probe array for neural signal acquisition. / Huang, Yu Chieh; Huang, Po Tsang; Hu, Yu Chen 等.
TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems. Institute of Electrical and Electronics Engineers Inc., 2017. p. 28-31 7993979 (TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems).

研究成果: 書貢獻/報告類型 › 會議論文篇章 › 同行評審

TY - GEN

T1 - A 64-channel wireless neural sensing microsystem with TSV-embedded micro-probe array for neural signal acquisition

AU - Huang, Yu Chieh

AU - Huang, Po Tsang

AU - Hu, Yu Chen

AU - Wu, Shang Lin

AU - You, Yan Huei

AU - Wang, Yung Kuei

AU - Duann, Jeng Ren

AU - Chiu, Tzai Wen

AU - Hwang, Wei

AU - Chen, Kuan Neng

AU - Chuang, Ching Te

AU - Chiou, Jin Chern

PY - 2017/7/26

Y1 - 2017/7/26

N2 - To enhance the signal integrity of high-density neural-sensing signals, this work presents an implantable high spatial resolution μ-probe array with through-silicon via (TSV) 2.5D integration technology that realizes a miniaturized implantable device on flexible printed circuit (FPC) interposer. The proposed microsystem was composed of two 32-channel neural sensing chips and one radio frequency chip for neural signal processing. The μ-probe array can achieve better signal-to-noise ratio with neural-signal acquisition and processing circuit composed of a pseudo-resistor-based analog front-end amplifier. Moreover, a receiving antenna is also implemented on the backside of FPC for wireless data and power transmission. The feasibility of the proposed μ-probe array, Tx and Rx antenna, 32-channel neural sensing circuits in the 64-channel wireless microsystem have been successfully demonstrated for future integration and animal experiments.

AB - To enhance the signal integrity of high-density neural-sensing signals, this work presents an implantable high spatial resolution μ-probe array with through-silicon via (TSV) 2.5D integration technology that realizes a miniaturized implantable device on flexible printed circuit (FPC) interposer. The proposed microsystem was composed of two 32-channel neural sensing chips and one radio frequency chip for neural signal processing. The μ-probe array can achieve better signal-to-noise ratio with neural-signal acquisition and processing circuit composed of a pseudo-resistor-based analog front-end amplifier. Moreover, a receiving antenna is also implemented on the backside of FPC for wireless data and power transmission. The feasibility of the proposed μ-probe array, Tx and Rx antenna, 32-channel neural sensing circuits in the 64-channel wireless microsystem have been successfully demonstrated for future integration and animal experiments.

KW - 2.5 D integration

KW - Flexible printed circuit (FPC)

KW - neural signal

KW - through-silicon via (TSV)

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U2 - 10.1109/TRANSDUCERS.2017.7993979

DO - 10.1109/TRANSDUCERS.2017.7993979

M3 - 會議論文篇章

AN - SCOPUS:85029382427

T3 - TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems

SP - 28

EP - 31

BT - TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017

Y2 - 18 June 2017 through 22 June 2017

ER -

Huang YC, Huang PT, Hu YC, Wu SL, You YH, Wang YK 等. A 64-channel wireless neural sensing microsystem with TSV-embedded micro-probe array for neural signal acquisition. 於 TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems. Institute of Electrical and Electronics Engineers Inc. 2017. p. 28-31. 7993979. (TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems). doi: 10.1109/TRANSDUCERS.2017.7993979

A 64-channel wireless neural sensing microsystem with TSV-embedded micro-probe array for neural signal acquisition

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