A 3.5-GHz SiGe 0.35μm HBT flip-chip assembled on ceramics integrated passive device Doherty power amplifier for SiP integration

Che Chung Kuo, Po An Lin, Jing Lin Kuo, Hsin Chia Lu, Yue Ming Hsin, Huei Wang

研究成果: 書貢獻/報告類型會議論文篇章同行評審

2 引文 斯高帕斯(Scopus)

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Engineering & Materials Science