3D Test Wrapper Chain Optimization with I/O Cells Binding Considered

Fan Hsuan Tang, Hsu Yu Kao, Shih Hsu Huang, Jin Fu Li

研究成果: 書貢獻/報告類型會議論文篇章同行評審

1 引文 斯高帕斯(Scopus)

摘要

Previous 3D test wrapper chain synthesis algorithms do not consider the binding of I/O cells (i.e., the association between scan chains and I/O cells). However, the binding of I/O cells may be specified as synthesis constraints. In this paper, we propose a 3D test wrapper chain optimization algorithm with I/O cells binding considered. Our objective is not only to reduce the required test time but also to reduce the number of test TSVs (through-silicon-vias) under I/O cells binding constraints. Our experiments show that the proposed algorithm greatly reduces both test time and test TSV count.

原文???core.languages.en_GB???
主出版物標題IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019
發行者Institute of Electrical and Electronics Engineers Inc.
ISBN(電子)9781728148700
DOIs
出版狀態已出版 - 10月 2019
事件2019 IEEE International 3D Systems Integration Conference, 3DIC 2019 - Sendai, Japan
持續時間: 8 10月 201910 10月 2019

出版系列

名字IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019

???event.eventtypes.event.conference???

???event.eventtypes.event.conference???2019 IEEE International 3D Systems Integration Conference, 3DIC 2019
國家/地區Japan
城市Sendai
期間8/10/1910/10/19

指紋

深入研究「3D Test Wrapper Chain Optimization with I/O Cells Binding Considered」主題。共同形成了獨特的指紋。

引用此