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Shi, Jin-Wei
(PI)
電機工程學系
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探索此專案觸及的研究主題。這些標籤是根據基礎獎勵/補助款而產生。共同形成了獨特的指紋。
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重量
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Keyphrases
Absorber
100%
Responsivity
100%
Ethernet
100%
Absorption Layer
66%
UTC-PD
66%
Backside Alignment
33%
Active Carriers
33%
Advanced Package
33%
Ethernet Communication
33%
Human Civilization
33%
DC Bias Circuit
33%
Active Windows
33%
Optical Fiber Tip
33%
Cabin
33%
Optical Fiber Communication
33%
Short-reach
33%
Active Area
33%
Transit Time
33%
Electrical Network
33%
Layer Thickness
33%
Novel Design
33%
Absorption Mechanism
33%
Photodetector
33%
Reverse Bias Voltage
33%
Device Technology
33%
Receiver Module
33%
Coupling Loss
33%
Package Technology
33%
Photonics
33%
P-type
33%
Photoabsorption
33%
High Linearity
33%
Flip-chip Bonding
33%
Type-II Interface
33%
Communication Systems
33%
Optical Beams
33%
InP Substrate
33%
Transimpedance Amplifier
33%
Band Gap
33%
19th Century
33%
Heterostructure
33%
Speed Performance
33%
Substrate Lens
33%
Revolutionary Change
33%
Photoreceiver
33%
Communication Networks
33%
Engineering
Responsivity
100%
Photodiode
66%
Absorption Layer
66%
Photonics
33%
Communication Network
33%
Coupling Loss
33%
Active Area
33%
Reverse Bias
33%
Bias Voltage
33%
Communication System
33%
Photodetector
33%
Active Carrier
33%
Amplifier
33%
Layer Thickness
33%
Heterojunctions
33%
Chip Bonding
33%
Band Gap
33%
Fiber Optics
33%