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表面氫鍵晶圓接合技術研究
Lee, Tien-Hsi
(PI)
機械工程學系
概覽
指紋
指紋
探索此專案觸及的研究主題。這些標籤是根據基礎獎勵/補助款而產生。共同形成了獨特的指紋。
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Keyphrases
Wafer
100%
Hydrogen Bonds (H-bonds)
100%
Silicon Carbide
100%
Nitrides
80%
Power Management chip
40%
Nitride Materials
40%
Electric Vehicle
40%
Artificial Intelligence of Things (AIoT)
40%
Hydrogen Bond Density
20%
Materials Manufacturing
20%
High Etching Resistance
20%
Infrastructure Construction
20%
Material Processing Technology
20%
Low-temperature Technologies
20%
Dielectric Coefficient
20%
Wide Energy Gap
20%
Infrared Spectrometer
20%
Bonded Wafer
20%
Communication Frequency
20%
Self-development
20%
IoT Sensors
20%
Sensor Networks
20%
Semiconductor Wafer
20%
Artificial Intelligence
20%
Material Properties
20%
Artificial Intelligence AI
20%
Investment Project
20%
Telecommunications
20%
Chemical Bond
20%
High-resolution
20%
Related Components
20%
Sample Preparation
20%
Silicon Crystal
20%
Wafer Bonding Technology
20%
5G Communication
20%
Power Energy
20%
High-tech Industry
20%
Mechanical Properties
20%
Network Bandwidth
20%
High Power
20%
Transmission Rate
20%
High Strain
20%
Electron Microscope
20%
Bandwidth Enhancement
20%
Self-driving Cars
20%
Core chip
20%
Internet Technology
20%
Low Temperature Treatment
20%
Energy Management
20%
Electric Energy
20%
Industry Development
20%
Vehicle Driving
20%
Bond Strength
20%
Thermal Conductivity
20%
Manufacturing Process
20%
U.S. Congress
20%
Bonding Mechanism
20%
Crystalline Materials
20%
Smart Devices
20%
Close Contact
20%
Bonding Process
20%
High Compatibility
20%
Chip Fabrication
20%
Manufacturing Technology
20%
Engineering
Nitride
100%
Wafer Bonding
100%
Electric Vehicle
75%
Nitride Material
50%
Power Management
50%
Artificial Intelligence
50%
Electric Energy
25%
Dielectrics
25%
Low-Temperature
25%
Manufacturing Process
25%
Bonding Process
25%
Thermal Conductivity
25%
Low Temperature Heat
25%
Bonding Technology
25%
Heat Treatment
25%
Bond Strength
25%
Manufacturing Engineering
25%
Energy Management
25%
Telecommunication
25%
IoT Sensor
25%
High Resolution
25%
Bonding Mechanism
25%
Smart Device
25%
Internet-Of-Things
25%
Band Gap
25%
Material Science
Aluminum Nitride
100%
Hydrogen Bonding
100%
Silicon Carbide
100%
Surface (Surface Science)
60%
Density
20%
Silicon
20%
Chemical Bonding
20%
Thermal Conductivity
20%
Nitride Compound
20%
Material Processing
20%
Heat Treatment
20%
Dielectric Material
20%
Materials Property
20%
IoT Sensor
20%